Product Features:
High output power
Equipped with pulse shape editing function
Adjustable pulse width and repetition rate to meet diverse processing requirements
Supports multiple pulse control modes including Burst/PSO/POD
Stable and reliable integrated structural design
Application Field:
Semiconductor wafer stealth dicing
-Product Features: High power, compact design, high stability andhigh reliability; adopts fully indepencent R&D technology with noisesuppression capability, internal modylar desian, the whole machineadopts a compact optoelectronic integrated design, supporting long. term stable operation.-Performance Parameters: Qutput power up to 30W; pulse width andrepetition rate are freely adjustable, with pulse output control and pulseshape editing functions. -Application Scenario: An ideal choice for precise and efficient cuttingof semiconductor materials.
Request a quotation
Online consultation
021-54163809
